Vaishnaw lays foundation for India’s first 3D glass chip unit in Odisha; ₹1,943 crore investment

India advanced its semiconductor push as Ashwini Vaishnaw and Mohan Charan Majhi laid the foundation stone for the country’s first 3D glass semiconductor packaging unit at Info Valley, Bhubaneswar, with an investment of ₹1,943 crore and central support of about ₹800 crore.The facility, expected by 2028, will produce 70,000 glass panels and 50 million units annually, generate over 2,500 jobs, and strengthen India’s semiconductor ecosystem for AI, 5G, and defence.